Jack attempts to perfect a technique to solder BGA chips at home using a pancake griddle. OLinuXino Open Source Hardware Linux computer was designed to be Do-It- Yourself friendly Linux computer, but the more powerful versions contains BGA ICs. Many people are afraid to try to solder BGA ICs and think, that this is very complicated process and require lot of expensive tools.
A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be use instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
Soldering of BGA devices . For any BGA soldering , the solder balls on the package have controlled amount of solder. When the Board with the solder balls and BGA Package is placed in the reflow oven, it gets heated and the solder melts. Reflowing the bga is a process in itself. The requirements are: preheat the entire board to the first step of the bga reflow profile.
Then apply local heat as evenly as possible to the bga solder balls. You can reflow smaller (256) bgas that are MONOLITHIC . Sometimes, expecially if they develop high temperatures during normal operations, the tin solder connecting their pins with board pads tend to become unreliable.
Having no leads to ben the PBGA has greatly reduced coplanarity problems and minimized handling issues. During reflow the solder balls are self-centering ( up to off the pad), thus reducing placement problems during surface mount. Normally, because of the larger ball pitch (typically mm) of a BGA over a QFP . Has anyone here ever hand- soldered a BGA device? Above is the typical top and bottom view of a BGA.
When soldered , small balls of solder attach the grid side to a similar grid on the main PCB. The height between the BGA and the main board is only a few mils, much too small to get. The solder pads are in a square or rectangular grid format with a pitch recommended by the JEDEC registration standard (MO-151) for the EBGAs.
The package is encapsulated to completely cover the chip, wires and substrate bondfingers. Cross-Sectional View of EBGA. TSBGA (TAPE SUPER BGA ) . Are they difficult to place – by machine ? Is it possible to place them by hand? Can a BGA be remove reworked and replaced? Can the PCB design influence the manufacturability?
If not, solder icicle as shown in the left side photo may occur while moving the tip. First of all, please apply flux.
Cleaning without flux, Cleaning with flux. Click here to enlarge the photos. Use it for cleaning after removal of BGA.
Procedures for BGA rework are well-defined and long establishe but there are six common mistakes. These mistakes can be costly leading to the following: 1. Excessive solder joint voiding. This is often due to incorrect solder paste selection or process parameters and can compromise the integrity of the attachment and . We also provide IPC training and solder certification courses.